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The original was posted on /r/gamingleaksandrumours by /u/JohnBarry_Dost on 2025-01-17 12:03:26+00:00.


Chinese forum leaker has claimed that AMD’s Zen 6, Zen 6 (Medusa) Halo APU, and next generation UDNA GPU will all be manufactured on TSMC’s N3E process technology.

  1. Zen 6 Halo will utilize 3D stacking for improved performance, N3E.
  2. AMD has revived its high end/flagship graphics chips for next generation UDNA (RDNA5) architecture set to launch in 2nd half 2026, N3E.
  3. Zen 6 IO chiplet to be upgraded to TSMC N4C process. (Cost optimized 4nm)
  4. Sony’s future console will similarly utilize chips with AMD’s 3D stacked designs. Process unknown.

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