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Joined 1 year ago
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Cake day: June 12th, 2023

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  • In this case does packaging mean packaging the silicon die to a processor or soc that can then be used? Or does it mean the assembly of the end product, such as a phone or laptop?

    In either case it seems like a moot point to complain that this is a major issue for the long term. Shouldn’t assembly lines for said stuff should be much easier to build in comparison to a chip fab?

    Also the fact that the Arizona fab only produces a small fraction of TSMC’s total output is kind of obvious. There are a lot of chip fabs, so US encouragement for domestic production has to be an ongoing effort.









  • Obviously that has to be reflected in the price of the product. Presumably even more so with storage.

    Also there might be a use case, where cost is paramount and the drive would experience very limited writes.

    I’ve got a personal anecdote that’s not entirely the same, but I’ve bought a bunch of flash chips from china to use with retro games. Those are often salvaged, but they are also cheap and available to buy. It doesn’t matter if the chips can’t take too many write cycles, if you only flash them a couple of times.



  • This is what 3d printing really shines in. Churning out prototypes for minimum cost.

    If you’re already familiar with blender, you would only need to learn how to use a slicer, which is not that hard in comparison. Just import the model and fiddle around with print settings if needed.

    I came into 3d printing as a complete noob, and most of my time has been spent learning to do modeling in blender/cad. Slicing and printing itself is simple in comparison. Resin might be more involved.